File:Wirebonding2.svg

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Description
English: A sketch diagram of the wedge-bond wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating material. The aluminium wires are generally around 250 to 400 µm thick.
Date
Source Own work
Author Inductiveload
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(Reusing this file)
I, the copyright holder of this work, hereby publish it under the following licences:
GNU head Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation Licence, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the licence is included in the section entitled GNU Free Documentation Licence.
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w:en:Creative Commons
attribution share alike
This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic licence.
You are free:
  • to share – to copy, distribute and transmit the work
  • to remix – to adapt the work
Under the following conditions:
  • attribution – You must give appropriate credit, provide a link to the licence, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
  • share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible licence as the original.
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Other versions

Derivative works of this file:  Wirebonding2 DE.svg

Based on Wirebonding.svg by Cyril Buttay.

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inception

19 November 2008

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Date/TimeThumbnailDimensionsUserComment
current12:38, 19 November 2008Thumbnail for version as of 12:38, 19 November 2008600 × 300 (21 KB)wikimediacommons>InductiveloadSomething odd is going on here. Sorry for any duplicate uploads.

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