This file is from Wikimedia Commons and may be used by other projects.
The description on its file description page there is shown below.
Summary
DescriptionUltrasonic wedge bonding.webm
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
Deitsch: Ultraschall-Wedge-Wedge-Bonden eines Aluminium-Drahts zwischen Gold-Kontakten einer Leiterplatte und auf einem Saphir-Substrat. NanoFabLab am AlbaNova Universitätszentrum/Stockholms Universität.
This file was selected as the media of the day for 04 July 2013. It was captioned as follows:
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
Other languages
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
中文(简体):引线接合
Licensing
I, the copyright holder of this work, hereby publish it under the following licence:
to share – to copy, distribute and transmit the work
to remix – to adapt the work
Under the following conditions:
attribution – You must give appropriate credit, provide a link to the licence, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible licence as the original.